Since its debut in 2006, the electronica Automotive Conference has become the flagship meeting point for engineers, managers and innovators tackling the next wave of vehicle technology. Every edition gathers top minds from the automotive and electronics sectors, offering a concentrated program that mirrors the rapid evolution of mobility solutions.
In 2026 the event returns as a dedicated one-day forum on November 9 at Messe München, Hall A6. Organized in the years between the larger electronica trade fairs, the conference delivers a compact yet intensive experience, complete with catering, presentation archives and optional attendance certificates.
Overview and schedule
The 2026 program runs from morning keynote sessions through to an afternoon panel series, all designed to fit within a single business day. Attendees receive full access to every presentation, a chance to network during scheduled breaks, and post-event digital copies of the slides. All logistical details, including registration processing, are handled by the official service provider appointed by Messe München.
Key topics for 2026
Five strategic themes shape the conference agenda, reflecting the most pressing challenges and opportunities facing modern mobility. Each session blends practical case studies with forward-looking research, ensuring participants leave with actionable insights.
Electrification across all vehicle classes
From hydrogen-fuel-cell trucks to compact battery-electric city cars, electrification the process of replacing internal-combustion powertrains with electric alternatives is examined across a spectrum of market segments. Speakers compare regional policy drivers, technology readiness levels and infrastructure requirements, highlighting where hybrid systems still serve as a bridge.
Software-based E/E architectures
The shift toward software-defined electrical/electronic (E/E) architectures is redefining vehicle development. Experts detail how cloud-native tools, over-the-air updates and modular software stacks are turning cars into adaptable platforms, reducing hardware complexity while boosting feature agility.
Holistic development processes
Creating sophisticated electronic systems now demands a seamless blend of hardware, software and tool-chains. Panels explore integrated design methodologies, model-based development and verification pipelines that help teams manage increasing system complexity without sacrificing time-to-market.
Automated driving and new vehicle concepts
Real-world deployments of automated driving technologies and emerging vehicle formats—such as shared autonomous pods—are shared by project leads who discuss sensor fusion, safety validation and regulatory pathways. The aim is to illustrate concrete steps toward Level 4/5 autonomy.
Geopolitical impacts of the semiconductor crisis
Supply-chain fragility, especially in semiconductors, continues to reshape industry strategies. Participants map the interdependencies among Europe, the United States and China, debate industrial-policy measures and propose routes to enhance resilience against future shortages.
Target audience and ticketing
The conference welcomes a broad cross-section of professionals: automotive manufacturers, tier-one suppliers, system designers, software developers, project managers, sales engineers and supply-chain specialists. Anyone steering forward-looking mobility projects will find relevant content and networking opportunities.
Registration is straightforward. A regular ticket grants entry to all sessions, catering and post-event presentation access. Students can attend free of charge upon providing proof of eligibility, but tickets are limited and issued on a first-come, first-served basis. Certificates of attendance are available on demand.
Program committee and leadership
The scientific direction is overseen by a distinguished Program Committee chaired by Peter Gresch of OptE GP Consulting. Members include Dr. Stephan Berlitz (Audi), Dr. Wolfgang Bochtler (JPW Asia Consulting), Dr. Joachim Damasky (LION Smart), Mustafa Dinc (Vishay), Ole Gerkensmeyer (Nexperia), Henrik Hammer (Analog Devices), Uwe Hauck (TE Connectivity), Dr. Wolfgang Huhn (DVN), Robert Isele (INOVA Semiconductors), Dr. Andreas Lock (Robert Bosch), Alexander Maier (BMW), Thomas Nindl (Brusa Elektronik), Georg Olma (NXP Semiconductors), Julia Riedel (STMicroelectronics), Martin Schleicher and Jürgen Weyer (Board JoysonPreh). Their collective expertise guarantees a program that captures both technical depth and strategic foresight.
